Blog dell'azienda Recycle TI In-Cabin Systems:Cluster,IVI,Displays,Driver Monitoring And Occupant Monitoring

Recycle TI In-Cabin Systems:Cluster,IVI,Displays,Driver Monitoring And Occupant Monitoring

Shenzhen Mingjiada Electronics Co., Ltd., as a leading enterprise in the electronic component recycling industry, provides comprehensive recycling solutions through professional services, highly competitive pricing and a principled business philosophy.

Recycling Service Highlights:

1. Product Categories

Specialising in all types of mainstream original manufacturer components:

- Primarily recycling memory (DDR3/4/5, LPDDR, NAND flash, eMMC, UFS, etc.), microprocessors (MPU/MCU), FPGA/SoC, 5G/Bluetooth/Wi-Fi 6 communication chips, automotive-grade ICs, AI/AR chips, sensors and module products; We only accept brand-new, genuine products sourced through authorised channels; counterfeit, disassembled, unidentified-origin or severely damaged components will not be accepted.

Comprehensive brand portfolio: covering stock from leading international manufacturers and top domestic chip suppliers; model compatibility spans consumer, industrial and automotive applications.

Diverse stock types: factory surplus, project surplus, over-procured stock, goods compliant with customs regulations, port returns and full warehouse clearances; we support bulk and full-container buybacks, whilst also accepting small batches of high-quality stock.

2. Condition and Testing Standards

Packaging Requirements: Priority is given to products in original manufacturer packaging, tubular packaging or vacuum-sealed packaging, accompanied by complete batch numbers and COC documentation. Bulk products must undergo X-ray inspection and functional testing to confirm wafer layer integrity and verify the absence of physical damage, corrosion or oxidation.

Data Security Compliance: Standardised data erasure protocols are performed on chips and modules with storage capabilities, accompanied by erasure reports, to prevent customer data leakage.

Graded Pricing System: Products are categorised as “Brand New & Unopened > Unused & Opened > Tested & Approved > Repairable Stock”; quotations are dynamically adjusted based on real-time global market conditions, model scarcity, year of manufacture and market demand.

3. Recycling Solutions

Global Coverage: We support cross-border delivery, door-to-door collection and global logistics tracking; settlement is available in multiple currencies.

Flexible Transaction Models: Cash on delivery (rapid settlement within 24–48 hours), consignment sales, consignment stock and bulk warehouse clearance; meeting clients’ diverse needs regarding capital recovery and inventory management.

Channel Legitimacy: We collaborate exclusively with authorised dealers, original equipment manufacturers and compliant traders; we reject products from illegal channels, contraband or infringing goods; mutual obligations are clearly defined through compliance agreements.

I. Digital Cluster: A Safe and Reliable Hub for Driving Information

The digital cluster serves as the vehicle’s core information interface, requiring real-time performance, stability, functional safety and high-definition display. TI delivers cluster solutions that meet stringent automotive-grade requirements through dedicated processors and supporting chipsets.

1. Core Processing Platform: Dual Assurance of Performance and Safety

Flagship Processor: Based on the Jacinto™ TDA4x/AM62x series SoCs, integrating dual-core Arm® Cortex®-A53/A72 application processors, a real-time Cortex-R5F MCU and dedicated hardware acceleration engines, balancing high-performance computing with hard real-time control.

Functional Safety: Supports ISO 26262 ASIL-B safety level, with built-in hardware self-tests, redundancy checks and fault diagnosis mechanisms to ensure zero-delay, error-free display of critical information such as vehicle speed, engine speed, fuel level and fault codes.

Multi-screen Coordination: Native support for cross-screen interaction and data sharing between the instrument cluster, IVI and HUD, compatible with a ‘single-chip, multi-screen’ domain control architecture, reducing the number of ECUs and lowering wiring harness costs.

2. Display and Interface Technology: High-definition and stable, suitable for diverse form factors

Display Drivers: Paired with DLP® technology and LED backlight drivers (such as the TPS926 series), supporting 12.3-inch, 2K high-definition virtual instrument clusters, enabling global/local dimming, high contrast, low-power consumption displays, and clear visibility in bright sunlight.

High-Speed Transmission: Utilising FPD-Link III/IV serialisers/deserialisers (DS90UB9 series), high-definition video, audio and control signals are transmitted via a single coaxial or twisted-pair cable, offering strong electromagnetic interference (EMC) resistance and suitability for long-distance, complex in-vehicle environments.

Scenario Adaptability: Supports a variety of interface formats, including traditional analogue needle displays, fully digital virtual displays, and AR navigation overlays, meeting the diverse requirements of vehicles ranging from entry-level to luxury models.

3. Solution Advantages

High Reliability: Automotive-grade chips (AEC-Q100 Grade 2) with a wide operating temperature range of -40°C to 125°C, and a Mean Time Between Failures (MTBF) far exceeding industry standards.

Low Power Consumption: Hardware-level power optimisation, with current consumption as low as the mA range in idle/sleep modes, reducing the load on the vehicle battery.

Easy to Develop: Provides complete reference designs, SDK software packages and AUTOSAR adaptation layers, shortening development cycles and reducing system complexity.

II. In-Vehicle Infotainment (IVI): An Immersive Smart Connectivity Hub

IVI is at the heart of in-cabin intelligence, supporting functions such as navigation, audio-visual entertainment, vehicle control and connectivity. TI leverages high-performance computing platforms and a rich array of peripheral interfaces to create a seamless, open and secure in-vehicle entertainment ecosystem.

1. Core Computing Architecture: High Performance and High Integration

Flagship Processors: The Jacinto TDA4VM/AM68x series integrates multi-core CPUs, GPUs (PowerVR™) and NPUs (neural network processors), supporting 4K video decoding, 3D graphics rendering, and AI-powered voice and image recognition.

System Compatibility: Native support for mainstream in-vehicle operating systems such as Linux, Android and QNX, compatible with third-party application ecosystems (navigation, music, connected car services).

Domain Control Convergence: Supports a centralised domain control architecture integrating IVI, instrument cluster and ADAS into a single domain, enabling shared hardware resources and unified software deployment, aligning with the trend towards software-defined vehicles.

2. Core Functions and Technical Features

Smart Connectivity: Integrates Wi-Fi 6, Bluetooth 5.3 and Ethernet; supports CarPlay/Android Auto smartphone connectivity, 5G vehicle-to-everything (V2X) communication and V2X data exchange, enabling full ‘vehicle-cloud-mobile’ connectivity.

Multimedia Experience: Supports multi-channel audio, high-definition video playback and multi-zone independent audio sources. Paired with TI audio codecs (such as the TLV320AIC), it delivers high-fidelity, low-noise in-car audio.

AI-Enabled: The built-in NPU supports offline voice recognition, voiceprint authentication and natural language interaction, with a response time of <200ms. It operates without reliance on the cloud, enhancing privacy and responsiveness.

3. Solution Advantages

Comprehensive Ecosystem: Covers the entire toolchain from chips, drivers and middleware to the application layer, supporting rapid customised development.

Security Isolation: Utilises hardware virtualisation technology to achieve secure isolation between the infotainment system and vehicle control functions, preventing system failures from compromising driving safety.

Scalability: A single platform covers everything from entry-level (single-screen, basic functions) to flagship-level (multi-screen, AR-HUD, full-vehicle connectivity), reducing R&D and material costs for automotive manufacturers.

III. Smart Displays: High-definition, Flexible and Reliable Interaction Interfaces

Modern vehicle cockpits are trending towards larger screens, multiple screens and non-standard shapes (centre console screens, front passenger screens, rear-seat screens, electronic exterior mirrors, etc.). TI provides a full range of display solutions—from drivers and transmission to control—to suit all types of in-vehicle display scenarios.

1. Comprehensive Display Support

Core Products:

FPD-Link Serialiser/Deserialiser: DS90UB954/953 and DS90UB971 series, supporting 4K@60fps ultra-high-definition transmission with a single-cable transmission distance of up to 15 metres. Supports PoC (Power over Coax), simplifying wiring for cameras and displays.

LED Backlight Drivers: TPS92692 and TPS92682 series, supporting 2D local dimming with a contrast ratio of up to 10,000:1, reducing power consumption and enhancing visibility, whilst meeting ASIL-B functional safety requirements.

Display Bridge ICs: Support interface conversion for MIPI DSI, LVDS, eDP and others, compatible with various display panels including LCD, OLED and Mini-LED.

2. Key Technical Highlights

Multi-screen Synchronisation: A single SoC supports synchronous output to 5–8 independent displays, enabling content sharing, drag-and-drop interaction and split-screen control across the central control unit, instrument cluster, front passenger and rear-seat screens.

Interference Resistance and Stability: Passes rigorous EMC testing to adapt to complex in-vehicle electromagnetic environments; supports hot-swapping and self-healing, ensuring rapid recovery from display anomalies without affecting the vehicle’s overall system.

Non-Standard and Innovative Displays: Supports curved screens, transparent screens and electronic exterior rear-view mirrors (CMS); utilises DLP technology to achieve high-definition AR-HUD projection, expanding the boundaries of in-cabin displays.

3. Solution Advantages

High Integration: A single chip integrates video processing, transmission and control functions, reducing the number of peripheral components and minimising PCB size.

Low Cost: PoC technology reduces the number of power supply cables, simplifies structural design, and lowers BOM and assembly costs.

Long Lifespan: The chip supports a vehicle service life of 10+ years, meeting the requirements for use throughout the vehicle’s entire lifecycle.

IV. Driver Monitoring System (DMS) and Occupant Monitoring System (OMS): The Core of Active Safety Cabin Perception

With the tightening of global automotive safety regulations (such as EU NCAP and China’s C-NCAP), DMS/OMS have become standard features in new vehicles. TI employs a vision-plus-radar fusion perception solution to achieve precise, all-weather, and all-scenario cabin safety monitoring.

1. Core Technology Architecture: Multi-sensor Fusion, AI-Powered Precision Analysis

Processing Platform: TDA4AL-Q1/AM62A series SoCs, integrating high-performance DSPs, NPUs and image signal processors (ISPs), supporting real-time processing of RGB-IR dual-camera data with computational power reaching 10+ TOPS.

Perception Solution:

Visual Perception: 2–8-megapixel RGB-IR cameras, paired with TI’s IR LED driver (TPS92638), support near-infrared illumination for clear imaging in all conditions, including darkness, strong light and tunnels.

Radar Perception: AWR2944 77GHz millimetre-wave radar, which supplements visual blind spots and detects subtle driver movements and vital signs, unaffected by lighting conditions or obstructions.

2. DMS: Driver Safety Guardian

Core Functions:

Fatigue Monitoring: Identifies closed eyes, yawning and drooping eyelids to provide early warnings of drowsy driving.

Distraction Monitoring: Detects looking down at a mobile phone, glancing around, and prolonged inattention whilst driving.

Hazardous Behaviour: Identifies violations such as not wearing a seatbelt, smoking, and taking both hands off the steering wheel.

Identity Recognition: Voiceprint + facial recognition, automatically loading personalised settings for seats, air conditioning, music, etc.

3. OMS: Comprehensive Passenger Safety Care

Core Functions:

Passenger Presence Detection: Accurately identifies rear-seat passengers (including children) to prevent them being left behind in the vehicle.

Posture and Status Monitoring: Detects abnormal seating postures, unfastened seatbelts, and accidental operation by children.

Vital Signs Monitoring: Radar + visual fusion, detecting occupant breathing and heart rate, with automatic alerts in case of abnormalities.

Interaction Enhancement: Recognises occupant gestures and gaze to enable contactless control of air conditioning and music.

4. Solution Advantages

Reliability in All Conditions: RGB-IR + millimetre-wave radar fusion ensures stable recognition in daylight/night, strong light/backlight, and when wearing masks or sunglasses.

Functional Safety: Complies with ISO 26262 ASIL-B; features hardware-level fault diagnosis and mandatory degradation to warning mode in the event of system anomalies.

Low Power Consumption and Compact Size: Single-chip solution with power consumption <5W, suitable for confined installation spaces such as A-pillars, rear-view mirrors and overhead lights.